Kupować ACCESSORIES-PLASTIC COVER 2.4 z BYCHPS
Kup z gwarancją
ACCESSORIES-PLASTIC COVER 2.4
- Part Number:
- ACCESSORIES-PLASTIC COVER 2.4
- Producent:
- Schaffner EMC, Inc.
- Opis:
- COVER TERM PLAS FN3359 600A
- Stan ołowiu / status RoHS:
- Bezołowiowa / zgodna z RoHS
- Dostępna Ilość:
- 19311 Pieces
- Arkusz danych:
- ACCESSORIES-PLASTIC COVER 2.4.pdf
Wprowadzenie
BYCHIPS jest dystrybutorem zaopatrzenia dla ACCESSORIES-PLASTIC COVER 2.4, mamy zapasów do natychmiastowej wysyłki, a także dostępne na długi czas dostaw. Prześlij nam swój plan zakupu dla ACCESSORIES-PLASTIC COVER 2.4 e-mailem, otrzymasz najlepszą cenę zgodnie z planem.
Specyfikacje
| Seria: | - |
|---|---|
| Inne nazwy: | 1151-053 801920 817-1771 ACCESSORIES-PLASTIC COVER 2.4-ND ACCESSORIES-PLASTICCOVER2.4 ACCESSORIES-PLASTICCOVER2.4-ND ACCESSORIESPLASTICCOVER24 |
| Poziom czułości na wilgoć (MSL): | 1 (Unlimited) |
| Standardowy czas oczekiwania producenta: | 10 Weeks |
| Numer części producenta: | ACCESSORIES-PLASTIC COVER 2.4 |
| Do użytku z / Podobne produkty: | FN3359 Series |
| Opis: | COVER TERM PLAS FN3359 600A |
| Typ akcesorium: | Cover |
| Email: | [email protected] |
Podobne zamienne do ACCESSORIES-PLASTIC COVER 2.4
| Obraz | Part Number | Producenci | Opis | Widok |
|---|---|---|---|---|
 |
ACCESSORIES-PLASTIC COVER 1.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 150-600A | Zapytanie ofertowe |
 |
ACCESSORIES-PLASTIC COVER 2.2 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 250A | Zapytanie ofertowe |
 |
ACCESSORIES-PLASTIC COVER 1.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3270 800/1000A | Zapytanie ofertowe |
 |
ACCESSORIES-PLASTIC COVER 2.1 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 150/180A | Zapytanie ofertowe |
 |
ACCESSORIES-PLASTIC COVER 2.5 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 800/1000A | Zapytanie ofertowe |
 |
ACCESSORIES-PLASTIC COVER 2.3 | Schaffner EMC Inc. | COVER TERM PLAS FN3359 320/400A | Zapytanie ofertowe |
Latest Aktualności
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog